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Multisim 11 is the latest version of its circuit simulation software, with specialized editions for both hands-on learning and professional circuit design. The easy-to-use Multisim software delivers a graphical approach that abstracts the complexities of traditional circuit simulation, helping educators, students and engineers employ advanced circuit analysis technology. The academic edition of Multisim 11 incorporates specialized teaching features and is complemented by circuits textbooks and courseware. This integrated system helps educators engage students and reinforce circuit theory with an interactive, hands-on approach to investigating circuit behavior. Multisim 11 Professional helps engineers optimize circuit designs, minimize errors and reduce prototype iterations. When combined with the new NI Ultiboard 11 layout and routing software, Multisim provides engineers a cost-effective, end-to-end prototyping platform. Its integration with NI LabVIEW measurement software also helps engineers define custom analyses to improve design validation…

Today's FPGAs are doubling in capacity every 2 years and have already surpassed the 5 million equivalent ASIC gate mark. With designs of this magnitude, the need for fast flows has never been greater. At the same time, designers are seeking rapid feedback on their ASIC or FPGA designs by implementing quick prototypes or initial designs on FPGA-based boards. These prototypes or designs allow designers to start development, verification and debug of the design—in the context of system software and hardware—and also to fine tune algorithms in the design architecture. Quick and intuitive debug iterations to incorporate fixes are of great value. The ability to perform design updates that don't completely uproot all parts of the design that have already been verified is also a bonus! Whether the goal is aggressive performance or to get a working initial design or prototype on the board as quickly as possible, this paper provides information on traditional and new techniques that accelerate design and debug iterations.

This article features an example chapter from a new *Hot-off-the-Press* book on FPGA Design that just recently hit the streets in August 2010. This chapter is reproduced here with the kind permission of the publisher – Springer. This book -- FPGA Design: Best Practices for Team-Based Design -- describes best practices for successful FPGA design. It is the result of the author’s meetings with hundreds of customers on the challenges facing each of their FPGA design teams. By gaining an understanding into their design environments, processes, what works and what does not work, key areas of concern in implementing system designs have been identified and a recommended design methodology to overcome these challenges has been developed.

With the introduction of the WEBENCH Online Design Environment in 1999, National Semiconductor made it possible for design engineers to create a reliable power supply circuit over the internet in minutes. The user specified the circuit performance and the WEBENCH Toolset delivered. Today, WEBENCH Designer creates and presents all of the possible power, lighting, or sensing circuits that meet a design requirement in seconds. This enables the user to make value based comparisons at a system and supply chain level before a design is committed. This expert analysis is not possible anywhere else.

In traditional short-haul microwave transmission (that is, line-of-sight microwave transmissions operating in the 18 GHz and 23 GHz radio bands),RF design engineers typically are concerned with signal aspects such as fade margins, signal reflections, multipath signals, and so forth. Like an accountant seeking to balance a financial spreadsheet, an RF design engineer normally creates an RF budget table, expressed in decibels (dB), in order to establish a wireless design. Aspects like transmit power and antenna gain are registered in the assets (or plus) column, and free space attenuation, antenna alignment, and atmospheric losses are noted in the liabilities (or minus) column. The goal is to achieve a positive net signal strength adequate to support the wireless path(s) called for in the design.

Three-dimensional microchip designs are making their way to market to help pack more transistors on a chip as traditional scaling slows down. By stacking logic chips on top of one another other or combining logic chips with memory or RF with logic, chipmakers hope to sidestep Moore's Law, increasing the functionality of smartphones and other gadgets not by shrinking a chip's transistors but the distance between them. "There's a big demand for smaller packages in the consumer market, especially for the footprint of a mobile phone, or for improving the memory bandwidth of your GPU," says Pol Marchal, a principal scientist of 3-D integration at European microelectronics R&D center Imec. On 9 February, at the IEEE International Solid-State Circuits Conference (ISSCC), in San Francisco, Imec engineers presented some key design challenges facing 3-D chips made by stacking layers of silicon circuits using vertical copper interconnects called through-silicon vias (TSVs). These design constraints will have to be dealt with before TSVs can be widely used in advanced microchip architectures, Marchal says.

Verification of algorithm-intensive systems is a long, costly process. Studies show that the majority of flaws in embedded systems are introduced at the specification stage, but are not detected until late in the development process. These flaws are the dominant cause of project delays and a major contributor to engineering costs. For algorithm-intensive systems —including systems with communications, audio, video, imaging, and navigation functions— these delays and costs are exploding as system complexity increases. It doesn't have to be this way. Many designers of algorithm-intensive systems already have the tools they need to get verification under control. Engineers can use these same tools to build system models that help them find and correct problems earlier in the development process. This can not only reduce verification time, but also improves the performance of their designs. In this article, we'll explain three practical approaches to early verification that make this possible. First, let's examine why the current algorithm verification process is inefficient and error-prone. In a typical workflow, designs start with algorithm developers, who pass the design to hardware and software teams using specification documents.

Given the maturity of MOSFETs, selecting one for your next design may seem deceptively simple. Engineers are familiar with the figures of merit on a MOSFET data sheet. Selecting a MOSFET requires the engineer to use their expertise in scrutinizing different specifications for individual applications. In an application such as a load switch in a server power supply, the switching aspects of a MOSFET matter little because the MOSFET is on almost 100% of the time. The on resistance (RDS(ON)) may be the key figure of merit in such an application. Still other applications, including switching power supplies, use MOSFETs as active switches, and cause the engineer to value other MOSFET performance parameters. Let us consider some applications and their prioritization of MOSFET specifications.

Lattice Diamond design software offers leading-edge design and implementation tools optimized for cost sensitive, low-power Lattice FPGA architectures. Diamond is the next generation replacement for ispLEVER featuring design exploration, ease of use, improved design flow, and numerous other enhancements. The combination of new and enhanced features allows users to complete designs faster, easier, and with better results than ever before.

You just built a breadboard of your expert design. You did all the simulations needed before going to layout, and reviewed the manufacturer's suggested techniques for a good thermal design for the particular package chosen. You even did your due diligence in going through the initial thermal analysis equations on paper to be sure not to exceed IC junction temperatures with a comfortable margin. But wait, you turn on the power and the IC is pretty hot to the touch. You are uncomfortable with this (not to mention the concern of your thermal experts and reliability people). Now what do you do?

It is no secret that field-programmable gate arrays (FPGAs) are getting bigger and more complex all the time. The fabrication process creates smaller transistors and makes more dense chips packing more digital processing per nanometer. Engineers love to see advancement because it means they can do more with modern silicon, and many times NI LabVIEW FPGA Module technology helps by abstracting the complexity to a higher level so that engineers can more smoothly take advantage of these improvements.  Unfortunately, there is one issue with FPGAs that continues to be a time sink and only gets worse with denser FPGAs: compilation time.

At three separate industry events last week, engineers said they are gearing up to deliver in 2011 chips that can handle serial data streams running at 25 Gbits/second to drive next-generation 100 and 400 Gbit/second networks. But they say it's still a mystery how—or if—they can deliver follow-on components for the terabit networks today's Internet data centers are already demanding. The kinds of jobs required to run today's Web 2.0 services such as Google and Facebook can completely overwhelm current 10 Gbit/s Ethernet links in the warehouse-sized data centers those companies use. Such data centers could use hundreds of 100 Gbit/s Ethernet links today, although standards for such networks are still being completed.

In earlier articles on intelligent sensor design, we saw how valuable they can be to both end users and those who manufacture and sell them. It’s now time to delve more deeply into what it takes to make intelligent sensors work.   The first step in that journey is to develop a solid, intuitive understanding of the principles of digital signal processing(DSP). Unlike many introductory DSP articles and texts, the focus here will be on presenting and using the important concepts rather than deriving them, for the simple reason that addressing the subject in depth is a book-sized, not a chapter-sized, project.

Simple mathematical analysis shows that the best answer to address this problem is to  select a CR ratio QGD/QGS1 that is less than 1. Other factors to consider for preventing C dv/dt induced turn-on include low driver-sinking impedance (<1 Ώ), a FET design with intrinsically low RG, an externally-applied G-S capacitor and Q2 packages that minimize parasitics and voltage ringing.

Predicting trends is difficult even by the most connected industry experts, but one trend that's easy to spot is the widespread acceptance of multicore SoC. This is happening for a number of reasons. First, it's been years since the workstation first adopted the multicore processor architecture to solve such issues as increasing performance and power concerns. While the adoption rate in workstations is now saturated and is fully supported by General Purpose OSs (GPOS), the embedded world is just now looking at ways to adopt multicore architecture. Second, several SoC vendors have been providing multicore solutions including Cavium, Freescale, MIPS, and ARM; but up until now, these solutions have been limited to networking and used for performance enhancements rather than for low power. The rest of the embedded industry has had limited hardware options available as low-power design is a driving factor. While the ARM 11 MPCore was ahead of its time, the Cortex-A9 MPCore design is ready for primetime and is gaining acceptance in the embedded marketplace. As a result, SoC vendors have adopted the Cortex-A9 MPCore hardware as a basis for their next generation designs. Over a year ago, Texas Instruments pre-announced their next-generation OMAP designs in the OMAP 4 with a dual-core Cortex-A9 MPCore, scheduled for production in the second-half of 2010. ST Microsystems has pre-announced their next generation consumer devices which will be based on the Cortex A9 MPCore.

By using a simple value process it is possible to speed up the analysis and help identify the best approach to take when developing a constant current regulation scheme for automotive interior LED lighting systems. Various approaches exist to address this particular design challenge that may result in a slowdown of the design process while engineering analysis can be performed to consider the advantages and disadvantages of the different options.

On Monday, National Instruments announced one such platform. It's called LabView Robotics. In addition to LabView, the popular data-acquisition application, the package includes a bunch of tools specific to robotics. It can import codes in various formats (C, C++, Matlab, VHDL), offers a library of drivers for a wide variety of sensors and actuators, and has modules for implementation of real-time and embedded hardware. NI says engineers could use the package to both design and run their robotic systems.